The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Apr. 24, 2018
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Chandra S. Namuduri, Troy, MI (US);

Lei Hao, Troy, MI (US);

Alexandru Rajala, Farmington Hills, MI (US);

Thomas W. Nehl, Shelby Township, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02N 11/08 (2006.01); H02K 11/33 (2016.01); H02K 11/21 (2016.01);
U.S. Cl.
CPC ...
F02N 11/0859 (2013.01); F02N 11/0851 (2013.01); F02N 11/0862 (2013.01); F02N 2011/0896 (2013.01); H02K 11/21 (2016.01); H02K 11/33 (2016.01);
Abstract

A starter assembly includes a multi-phase brushless electric motor including a stator, a rotor disposed on a rotatable shaft, and a motor endcap disposed at a first end of the stator. An electronic commutator assembly includes a sensing circuit, a control electronics subassembly, a power electronics subassembly and a heat sink. The sensing circuit is disposed adjacent to the second end of the rotatable shaft. The control electronics subassembly, the power electronics subassembly and the heat sink are disposed on disk-shaped devices arranged in a stacked configuration orthogonal to the axis defined by the rotatable shaft. The control electronics subassembly is disposed adjacent to the sensing circuit, and the power electronics subassembly is disposed adjacent to the control electronics subassembly. The control electronics subassembly is interposed between the power electronics subassembly and the sensing circuit. The heat sink is disposed adjacent to the power electronics subassembly.


Find Patent Forward Citations

Loading…