The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jun. 29, 2017
Applicant:
Ipi Tech Inc., Daejeon, KR;
Inventors:
Assignee:
IPI TECH INC., Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/29 (2018.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/488 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); H01L 21/02 (2013.01); H01L 21/48 (2013.01); H01L 21/6836 (2013.01); H01L 23/488 (2013.01); H01L 23/498 (2013.01); H01L 24/50 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/162 (2020.08); C09J 2479/086 (2013.01); H01L 21/563 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68377 (2013.01); H01L 2924/07025 (2013.01); Y10T 428/28 (2015.01); Y10T 428/2848 (2015.01);
Abstract
Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.