The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Apr. 27, 2017
Adeka Corporation, Tokyo, JP;
Hiroki Akatsu, Saitama, JP;
Takashi Ayabe, Saitama, JP;
ADEKA CORPORATION, Tokyo, JP;
Abstract
A resin composition comprises (A) 100 parts by mass of a resin selected from the group consisting of polyamides, polylactic acids, and polyphenylene sulfides each having a melting point of 170° C. to 370° C., (B) 0.05 to 5.0 parts by mass of a triazine compound represented by the disclosed general formula (1), preferred examples of which are compounds of the formula: wherein R, R, R, and R, which may be the same or different, each represent a hydrogen atom or a C1-C4 alkyl group, (C) 0 to 3.0 parts by mass of at least one compound selected from the group consisting of 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-[3-hydroxy-4-(4,6-diphenyl-1,3,5-triazin-2-yl)phenoxy]ethyl 2-ethylhexanoate, and 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, and (D) 0 to 1.0 part by mass of a light stabilizer being particulate at room temperature (25° C.). The resin composition is useful for making molded articles having improved heat resistance and weatherability.