The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jun. 13, 2019
Applicant:
Ceraloc Innovation Ab, Viken, SE;
Inventors:
Darko Pervan, Viken, SE;
Tony Pervan, Stockholm, SE;
Assignee:
CERALOC INNOVATION AB, Viken, SE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 11/00 (2006.01); B05D 5/06 (2006.01); B41M 5/00 (2006.01); B41M 3/00 (2006.01); B41M 5/50 (2006.01); B05D 1/36 (2006.01); B05D 1/02 (2006.01); B41F 19/00 (2006.01); B41J 3/28 (2006.01); B41J 3/407 (2006.01); B44C 1/24 (2006.01); B44C 5/04 (2006.01); B05D 1/12 (2006.01); C09D 7/40 (2018.01); B05D 3/12 (2006.01); C09D 11/037 (2014.01); C09D 161/28 (2006.01); B41J 3/54 (2006.01); B05D 7/00 (2006.01); B41M 1/38 (2006.01); B41F 17/00 (2006.01); B41J 2/32 (2006.01); B41J 2/325 (2006.01); B05D 3/00 (2006.01); B05D 3/06 (2006.01); C09D 11/103 (2014.01); C08K 3/22 (2006.01); C09D 197/02 (2006.01); B41F 19/02 (2006.01); C09D 11/02 (2014.01); B41J 2/14 (2006.01); B41J 2/01 (2006.01); B05D 5/02 (2006.01); B05D 7/06 (2006.01); B32B 27/14 (2006.01); B41M 1/22 (2006.01); B41J 2/005 (2006.01);
U.S. Cl.
CPC ...
B41J 11/002 (2013.01); B05D 1/02 (2013.01); B05D 1/12 (2013.01); B05D 1/36 (2013.01); B05D 3/002 (2013.01); B05D 3/065 (2013.01); B05D 3/067 (2013.01); B05D 3/12 (2013.01); B05D 5/06 (2013.01); B05D 7/50 (2013.01); B05D 7/52 (2013.01); B05D 7/53 (2013.01); B41F 17/00 (2013.01); B41F 19/002 (2013.01); B41F 19/02 (2013.01); B41J 2/01 (2013.01); B41J 2/14088 (2013.01); B41J 2/32 (2013.01); B41J 2/325 (2013.01); B41J 3/28 (2013.01); B41J 3/407 (2013.01); B41J 3/54 (2013.01); B41J 11/0015 (2013.01); B41M 1/38 (2013.01); B41M 3/00 (2013.01); B41M 5/00 (2013.01); B41M 5/0017 (2013.01); B41M 5/0023 (2013.01); B41M 5/0029 (2013.01); B41M 5/50 (2013.01); B41M 5/502 (2013.01); B41M 5/506 (2013.01); B44C 1/24 (2013.01); B44C 5/04 (2013.01); C08K 3/22 (2013.01); C09D 7/69 (2018.01); C09D 11/02 (2013.01); C09D 11/037 (2013.01); C09D 11/103 (2013.01); C09D 161/28 (2013.01); C09D 197/02 (2013.01); B05D 5/02 (2013.01); B05D 7/06 (2013.01); B05D 2401/32 (2013.01); B32B 27/14 (2013.01); B41F 19/007 (2013.01); B41J 2/005 (2013.01); B41M 1/22 (2013.01); B41M 5/0041 (2013.01); B41M 5/0076 (2013.01); C08K 2003/2227 (2013.01); Y10T 428/24066 (2015.01); Y10T 428/24901 (2015.01);
Abstract
A method of forming a digital embossing on a surface by bonding hard press particles to a carrier. A liquid binder pattern is applied on the carrier by a digital drop application head. Hard press particles are applied on the carrier and the binder pattern such that some hard press particles are bonded to the carrier by the liquid pattern and non-bonded press particles are removed. The carrier with the bonded hard press particles is pressed to the surface and an embossing is formed when the carrier with the hard press particles is removed.