The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Feb. 01, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yasuaki Kitayama, Yokohama, JP;

Yukuo Yamaguchi, Tokyo, JP;

Kyosuke Toda, Kawasaki, JP;

Keiichiro Tsukuda, Yokohama, JP;

Kazuhiko Okito, Hiratsuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B29C 45/14 (2006.01); B41J 2/175 (2006.01); B29C 45/16 (2006.01); B29L 31/00 (2006.01); B29C 45/46 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1637 (2013.01); B29C 45/14467 (2013.01); B29C 45/16 (2013.01); B41J 2/1623 (2013.01); B41J 2/175 (2013.01); B41J 2/1752 (2013.01); B41J 2/17523 (2013.01); B41J 2/17553 (2013.01); B41J 2/17559 (2013.01); B29C 45/462 (2013.01); B29L 2031/767 (2013.01); B29L 2031/7678 (2013.01);
Abstract

A manufacturing method of a liquid supply component in which a liquid supply path is formed between a first constituent component and a second constituent component that are joined with molten resin. The method includes a first step of preparing these constituent components, a second step of causing the constituent components to face each other and forming an orifice portion and a reservoir portion between a mold and a surface of either of the constituent components, and a third step of pouring the molten resin between the constituent components so that it flows into the reservoir portion through the orifice portion.


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