The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Oct. 19, 2016
Applicant:

Hewlett-packard Development Company, L.p., Fort Collins, CO (US);

Inventors:

Salvador Sanchez Ribes, Barcelona, ES;

Hector Lebron, San Diego, CA (US);

Juan J Hernandez, San Diego, CA (US);

Emilio Carlos Cano, San Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/106 (2017.01); B29C 64/264 (2017.01); B29C 64/205 (2017.01); B29C 35/16 (2006.01); F28D 1/02 (2006.01); F28D 1/06 (2006.01); B29C 64/209 (2017.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B29C 64/20 (2017.01); B29C 64/255 (2017.01);
U.S. Cl.
CPC ...
B29C 64/106 (2017.08); B29C 35/16 (2013.01); B29C 64/165 (2017.08); B29C 64/205 (2017.08); B29C 64/209 (2017.08); B29C 64/264 (2017.08); F28D 1/0213 (2013.01); F28D 1/06 (2013.01); B29C 64/20 (2017.08); B29C 64/255 (2017.08); B29C 2035/1616 (2013.01); B29C 2035/1625 (2013.01); B29C 2035/1658 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); F28D 2001/0286 (2013.01);
Abstract

An apparatus and method for generating a three-dimensional object. The apparatus includes a build material area, at least one agent distributor with a fluid reservoir to store fluid agent and at least one fluid ejection die to selectively eject fluid agent in the build material area. A cooling system to remove heat from the at least one fluid ejection die has a heat sink. The at least one fluid ejection die is in thermal contact with the heat sink via the fluid agent of the fluid reservoir.


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