The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Dec. 25, 2017
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventor:

Daiki Funaoka, Tokyo, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); A61M 25/00 (2006.01); B29C 45/37 (2006.01); B29L 23/00 (2006.01); A61M 25/10 (2013.01);
U.S. Cl.
CPC ...
B29C 45/14008 (2013.01); B29C 45/14819 (2013.01); B29C 45/37 (2013.01); A61M 25/0026 (2013.01); A61M 25/1036 (2013.01); A61M 2025/0037 (2013.01); B29C 2045/1486 (2013.01); B29C 2045/14852 (2013.01); B29C 2945/76013 (2013.01); B29C 2945/76254 (2013.01); B29L 2023/00 (2013.01);
Abstract

An object of the present invention is to provide a technique by which, when producing a resin molded article using an insert member having low pressure resistance, molding can be easily performed, and deformation of the insert member can be suppressed. A method for producing a resin molded article of the present invention, the method includes the steps of disposing an insert member in a cavity of a mold; performing injection of molten resin into the cavity; terminating the injection on and after the molten resin reaches an overflow portion in the cavity and before the molten resin fills the overflow portion; and separating resin in the overflow portion.


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