The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jul. 27, 2017
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Masaki Mitsunaga, Osaka, JP;
Hodaka Yokomizo, Osaka, JP;
Assignee:
Teijin Limited, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/58 (2006.01); B32B 27/12 (2006.01); B32B 37/10 (2006.01); B29C 43/52 (2006.01); B29K 77/00 (2006.01); B29K 105/12 (2006.01); B29K 67/00 (2006.01); B29K 101/12 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 43/58 (2013.01); B29C 43/52 (2013.01); B32B 27/12 (2013.01); B32B 37/10 (2013.01); B29C 2043/5808 (2013.01); B29C 2043/5816 (2013.01); B29C 2043/5833 (2013.01); B29K 2067/006 (2013.01); B29K 2077/00 (2013.01); B29K 2101/12 (2013.01); B29K 2105/12 (2013.01); B29K 2307/04 (2013.01);
Abstract
Provided is a method for manufacturing a fiber-reinforced resin molded article by cold press molding a fiber-reinforced resin material including reinforcing fibers and a thermoplastic resin using molds containing an upper mold and a lower mold. In the method, the respective parameters for: heating temperature; charge time; air-cooling rate; pressurization time; flow-stopping temperature; and a moldable time satisfies specified numerical ranges simultaneously.