The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Jul. 11, 2016
Applicant:
Laird Technologies, Inc., Earth City, MO (US);
Inventors:
Mark D. Kittel, Berea, OH (US);
Jason L. Strader, Cleveland, OH (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H05K 7/20 (2006.01); B23P 15/26 (2006.01); H01L 23/42 (2006.01); H01L 21/48 (2006.01); B29C 63/02 (2006.01); H01L 23/00 (2006.01); B29C 63/00 (2006.01); C07C 323/00 (2006.01); C08L 53/02 (2006.01); H01L 27/146 (2006.01); B23K 20/18 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); B29C 63/02 (2013.01); H01L 21/4803 (2013.01); H01L 21/4882 (2013.01); H01L 21/67132 (2013.01); H01L 23/42 (2013.01); H01L 24/743 (2013.01); H05K 7/2039 (2013.01); B23K 20/18 (2013.01); B29C 63/0013 (2013.01); C07C 323/00 (2013.01); C08L 53/02 (2013.01); H01L 24/40 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 27/14618 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); Y10T 156/107 (2015.01); Y10T 156/108 (2015.01);
Abstract
A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.