The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Aug. 28, 2018
Sodick Co., Ltd., Kanagawa, JP;
Ichiro Araie, Kanagawa, JP;
Kazufumi Nambu, Kyoto, JP;
Atsushi Hirota, Kyoto, JP;
Hiroshi Amioka, Kyoto, JP;
Shuji Okazaki, Kanagawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
A lamination molding apparatus, includes a material layer former to form a material layer; a first emitter to form a solidified layer by irradiating the material layer with a first beam; and a thermal adjuster to adjust a temperature of at least a portion of the solidified layer to at least one of a predetermined first temperature and a predetermined second temperature. The temperature of at least the portion of the solidified layer is adjusted to the first temperature, and then to the second temperature. When the first temperature is referred to as T, the second temperature is referred to as T, a martensite start temperature of the solidified layer is referred to as Ms, and a martensite finish temperature of the solidified layer is referred to as Mf, all of the following relations of T≥Mf, T>T, and T≤Ms are satisfied.