The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Oct. 30, 2019
Applicant:

Ihi Corporation, Koto-ku, JP;

Inventors:

Ryosuke Ikeda, Tokyo, JP;

Yoshiyuki Iso, Tokyo, JP;

Shiko Nakamura, Tokyo, JP;

Hirohito Okuhara, Tokyo, JP;

Kenji Takano, Tokyo, JP;

Assignee:

IHI Corporation, Koto-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01F 3/04 (2006.01); B01J 19/32 (2006.01); B01D 53/14 (2006.01); B01D 53/18 (2006.01); B01D 53/62 (2006.01); B01D 53/78 (2006.01);
U.S. Cl.
CPC ...
B01J 19/32 (2013.01); B01D 53/1475 (2013.01); B01D 53/18 (2013.01); B01D 53/62 (2013.01); B01D 53/78 (2013.01); B01F 3/04 (2013.01); B01F 3/04078 (2013.01); B01D 2252/2026 (2013.01); B01D 2252/20484 (2013.01);
Abstract

A hydrophilized material has a surface provided with surface roughness that arithmetic mean roughness is 0.3 μm to 1.0 μm and mean width of roughness profile elements is 0.1 mm or less. A hydrophilized member that contacts a liquid is at least partially made of the hydrophilized material. The hydrophilized member is applicable to a gas-liquid contact apparatus having a gas-liquid contact section, a liquid supply system, and a gas supply system, to constitute the gas-liquid contact section as a packing element. Wettability imparted due to the surface roughness is exhibited continuously.


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