The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Sep. 06, 2018
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Tetsuya Tanaka, Fukuoka, JP;
Masahiko Akasaka, Fukuoka, JP;
Koji Sakurai, Fukuoka, JP;
Toshihiko Nagaya, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 13/04 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H05K 3/12 (2013.01); H05K 3/306 (2013.01); H05K 3/321 (2013.01); H05K 3/341 (2013.01); H05K 3/3447 (2013.01); H05K 13/0469 (2013.01); H05K 3/1216 (2013.01); H05K 3/303 (2013.01); H05K 3/3485 (2020.08); Y10T 29/49139 (2015.01);
Abstract
There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.