The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

May. 15, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Min-Soo Kim, Gyeongsangbuk-do, KR;

Ji-Woo Lee, Gyeongsangbuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01); H05K 1/02 (2006.01); H02K 1/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H05K 1/0207 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 9/0024 (2013.01); H05K 2201/10371 (2013.01);
Abstract

An electronic device, according to various embodiments of the present invention, may comprise: a housing which comprises a first surface, a second surface facing the opposite direction from the first surface, and a cooling member arranged between the first surface and the second surface; a circuit board which is disposed inside the housing; at least one heating component which is mounted to the circuit board; a shield can which surrounds one portion of the at least one heating component; a conductive member which makes contact with a first surface of the at least one heating component; a first thermal conduction member which diffuses heat from the at least one heating component to a plane direction parallel with the first surface of the heating component; and a second thermal conduction member which makes contact with a first surface of the first thermal conduction member, receives the heat from the first thermal conduction member in a second direction perpendicular to the plane direction, and transfers the heat to the cooling member. In addition, various embodiments are possible.


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