The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jan. 10, 2020
Applicants:

Arlanxeo Singapore Pte. Ltd., Singapore, SG;

The University of Windsor, Windsor, CA;

Inventors:

Lorenzo Ferrari, Burlington, CA;

Gregory J. E. Davidson, London, CA;

Tricia Breen Carmichael, Windsor, CA;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2019.01); H05K 5/06 (2006.01); B32B 25/18 (2006.01); B32B 17/10 (2006.01); B32B 17/06 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); B32B 17/1055 (2013.01); B32B 25/18 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); B32B 2250/02 (2013.01); B32B 2255/205 (2013.01); B32B 2307/7242 (2013.01); B32B 2457/00 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/239 (2015.01);
Abstract

This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours.


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