The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Apr. 30, 2019
Applicant:
Shenzhen Torey Microelectronic Technology Co. Ltd., Shenzhen, CN;
Inventor:
Nobuaki Asayama, Sakai, JP;
Assignee:
SHENZHEN TOREY MICROELECTRONIC TECHNOLOGY CO. LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H05K 1/05 (2013.01); H05K 2201/10681 (2013.01);
Abstract
A tape wiring board includes an insulating film on which a semiconductor chip is mounted and metal layers formed on both principal surfaces, respectively, of the insulating film. That one of the metal layers which is formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is mounted has a first electrode that is placed near substantially the center of a region on the first surface where the semiconductor chip is mounted.