The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jun. 09, 2016
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, JP;

Inventors:

Akifumi Tosa, Komaki, JP;

Yasuhiko Inui, Kani, JP;

Kaname Miwa, Komaki, JP;

Yosuke Shinozaki, Tajimi, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/26 (2006.01); H01L 21/67 (2006.01); H05B 1/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05B 3/26 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H05B 1/0233 (2013.01);
Abstract

A multilayer heating body () includes a ceramic substrate (), an electrode (), heaters (), terminals (), and an electricity supply path (). Through vias which constitute the electricity supply path include at least one combination of through vias α, β, γ, and δ which meets the following conditions (1) and (2). Condition (1): when the ceramic substrate is viewed from the front surface (3) side toward the back surface (3) side, the through via δ is located at a position where the through via δ overlaps the through via β, or in the vicinity of the through via β. Condition (2): when the ceramic substrate is viewed from the front surface side toward the back surface side, the through via γ is located at a position between the through via α and the through via δ, or located at a position where the through via γ overlaps the through via α, or in the vicinity of the through via α.


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