The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

May. 24, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Qhalid Fareed, Richardson, TX (US);

Naveen Tipirneni, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 21/8252 (2006.01); H01L 27/06 (2006.01); H01L 21/306 (2006.01); H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0883 (2013.01); H01L 21/30612 (2013.01); H01L 21/30621 (2013.01); H01L 21/8252 (2013.01); H01L 27/0605 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 21/02241 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/4236 (2013.01);
Abstract

A semiconductor device containing an enhancement mode GaN FET on a III-N layer stack includes a low-doped GaN layer, a barrier layer including aluminum over the low-doped GaN layer, a stressor layer including indium over the barrier layer, and a cap layer including aluminum over the stressor layer. A gate recess extends through the cap layer and the stressor layer, but not through the barrier layer. The semiconductor device is formed by forming the barrier layer with a high temperature MOCVD process, forming the stressor layer with a low temperature MOCVD process and forming the cap layer with a low temperature MOCVD process. The gate recess is formed by a two-step etch process including a first etch step to remove the cap layer, and a second etch step to remove the stressor layer.


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