The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Mar. 12, 2020
Sandisk Technologies Llc, Addison, TX (US);
Nagesh Vodrahalli, Los Altos, CA (US);
Shrikar Bhagath, San Jose, CA (US);
Chih Yang Li, Menlo Park, CA (US);
Srinivasan Sivaram, Los Gatos, CA (US);
Rama Shukla, Saratoga, CA (US);
SanDisk Technologies LLC, Plano, TX (US);
Abstract
A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.