The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Mar. 06, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jae Hoon Choi, Suwon-si, KR;
Doo Hwan Lee, Suwon-si, KR;
Joo Young Choi, Suwon-si, KR;
Sung Han, Suwon-si, KR;
Byung Ho Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.