The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jul. 23, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Younhee Kang, Asan-si, KR;
Byoung-Gug Min, Seongnam-si, KR;
Shi-Kyung Kim, Hwaseong-si, KR;
Min-Woo Song, Sejong-si, KR;
Jae-Seon Hwang, Asan-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3128 (2013.01); H01L 24/48 (2013.01);
Abstract
Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.