The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jan. 23, 2019
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Shu Zhang, San Diego, CA (US);
Daniel Daeik Kim, Del Mar, CA (US);
Chenqian Gan, Shanghai, CN;
Bonhoon Koo, San Diego, CA (US);
Babak Nejati, San Diego, CA (US);
Assignee:
Qualcomm Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01L 23/64 (2006.01); H01F 17/02 (2006.01); H01F 17/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01F 17/0013 (2013.01); H01F 17/02 (2013.01); H01F 27/2804 (2013.01); H01F 41/042 (2013.01); H01L 23/49822 (2013.01); H01L 23/645 (2013.01); H01L 28/10 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0073 (2013.01); H01F 2027/2809 (2013.01);
Abstract
Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.