The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jan. 12, 2018
Applicant:
Magnachip Semiconductor, Ltd., Cheongju-si, KR;
Inventors:
Moon Taek Sung, Sejong-si, KR;
Jae Sik Choi, Cheongju-si, KR;
Assignee:
MagnaChip Semiconductor, Ltd., Cheongju-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49524 (2013.01); H01L 23/49531 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor package device includes a lead frame including a lead frame pad and lead frame leads, a semiconductor chip located on the lead frame pad, and a substrate located on the semiconductor chip, wherein the lead frame leads include first lead frame leads coupled to the lead frame pad and second lead frame leads separated from the lead frame pad and attached to a bottom surface of the substrate.