The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Feb. 19, 2016
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventor:

Masaki Taya, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/16 (2006.01); H01L 25/18 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/29 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/296 (2013.01); H01L 25/071 (2013.01); H01L 25/18 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A power module will be provided which can suppress insulation performance deterioration caused by heat cycle to ensure insulation performance, by suppressing generation of bubbles and occurrence of detachments between silicone gel and an insulating substrate at a high or low temperature or at a high working voltage. The power module includes: an insulating substrateon a first face of which a semiconductor elementis provided; a base platejoined to a second face of the insulating substrate; a case membersurrounding the insulating substrateand being in contact with a face of the base plate, that is joined to the insulating place; sealing resinfilling a region surrounded by the base plateand the case memberto seal the insulating substrate; a pressing platedisposed in close contact with a surface of the sealing resinin a side of the first face of the insulating substrate; and a lid memberfacing an opposite face of the pressing platewith respect to a face thereof in close contact with the sealing resin, and being fixed to the case memberat a position to prevent the pressing platefrom ascending.


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