The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Nov. 14, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Aakash Pushp, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/285 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02639 (2013.01); H01L 21/0262 (2013.01); H01L 21/02068 (2013.01); H01L 21/02381 (2013.01); H01L 21/02546 (2013.01); H01L 21/0332 (2013.01); H01L 21/28568 (2013.01); H01L 21/3081 (2013.01);
Abstract

A hybrid template assisted selective epitaxy (HTASE) process is described comprising the steps of: depositing a template oxide layer on top of a silicon fin; opening a via in a selected portion of the template oxide to expose a portion of the encapsulated silicon fin and subsequently growing a nitride superconductor layer on top of the exposed silicon fin thereby forming a hybrid encapsulation of the silicon fin; performing a back-etch of the silicon fin to remove a portion (e.g., 5 nm-20 um) of the silicon fin; growing a layer formed from a group III/group V compound within an area where the silicon fin was removed via the back-etch; and if needed, removing the template oxide layer.


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