The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

May. 02, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Toshihiro Harada, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/12 (2006.01); H01G 2/06 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); H01G 2/065 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01);
Abstract

An electronic component includes a laminate and an external electrode provided on an end surface of the laminate. The external electrode includes a Ni layer provided on the end surface, a Ni—Sn alloy layer provided on the Ni layer, and a resin layer that is provided on the Ni—Sn alloy layer and includes metal grains including Sn grains. The Ni layer and the Ni—Sn alloy layer reduce or prevent intrusion of moisture from the external electrode into an interior of the laminate, and the resin layer reduces or prevents generation of cracks when a bending stress is applied to the external electrode.


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