The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Sep. 19, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventor:

Shimpei Tanabe, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01G 4/40 (2006.01); H01F 41/04 (2006.01); H03H 7/01 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01G 4/40 (2013.01); H03H 7/0115 (2013.01); H03H 7/1775 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0026 (2013.01); H01F 2017/0073 (2013.01); H03H 2001/0085 (2013.01);
Abstract

An electronic component is mounted on a circuit board such that a mounting surface of an element body to which a first outer electrode and a second outer electrode are exposed is directed toward the circuit board. A coil is formed of a spiral coil in which a plurality of coil conductor layers arranged in a direction perpendicular to a first side surface and a second side surface orthogonal to the mounting surface are connected in series. Then, an intermediate point between a lowest point closest to the mounting surface and an uppermost point farthest from the mounting surface in an inner circumference of the coil is offset from the center of the element body in a direction perpendicular to the mounting surface toward the opposite side to the mounting surface.


Find Patent Forward Citations

Loading…