The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jun. 17, 2020
Applicant:

Koa Corporation, Ina, JP;

Inventors:

Yuichi Abe, Ina, JP;

Seiji Karasawa, Ina, JP;

Michio Kubota, Ina, JP;

Yoji Gomi, Ina, JP;

Koichi Minowa, Ina, JP;

Assignee:

KOA CORPORATION, Ina, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 17/28 (2006.01);
U.S. Cl.
CPC ...
H01C 17/28 (2013.01);
Abstract

The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.


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