The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Nov. 14, 2019
Applicant:

Pegatron Corporation, Taipei, TW;

Inventors:

Chien-I Chen, Taipei, TW;

Wei-Pang Lee, Taipei, TW;

Hsin-Lan Liao, Taipei, TW;

Chen-Wei Lai, Taipei, TW;

Yi-Lun Tsao, Taipei, TW;

Jyun-Yi Lee, Taipei, TW;

Assignee:

PEGATRON CORPORATION, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/02 (2006.01); B29C 43/32 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); B29C 43/32 (2013.01); G06F 1/1616 (2013.01); H05K 5/0217 (2013.01);
Abstract

An electronic device includes a housing and a buffer component. The housing has a corner portion and two side edges adjacent to the corner portion. The buffer component is embedded in the corner portion and includes a strengthened layer and a buffer layer. The strengthened layer includes an arc-shaped side edge and an embedded portion. The embedded portion is embedded in the corner portion, such that the arc-shaped side edge is aligned with the two side edges. The strengthened layer is a strengthened material structure. The buffer layer is disposed between the strengthened layer and the housing, and the buffer layer is an elastic material structure.


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