The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jun. 14, 2018
Honeywell International Inc., Morris Plains, NJ (US);
Raj Mohan Bharadwaj, Maple Grove, MN (US);
Andrew Peter Vechart, Minnetrista, MN (US);
Suresh Sundarraj, West Richland, WA (US);
Piyush Ranade, Minneapolis, MN (US);
HONEYWELL INTERNATIONAL INC., Charlotte, NC (US);
Abstract
A computer-implemented method for predicting material properties in an Additive Manufacturing (AM) process is provided. The method comprises: receiving sensor data during the build of a metallic component using the AM process wherein the sensor data includes time-series temperature data of a surface of the metallic component recorded by a photodiode and time-series temperature data of a surface of the metallic component recorded by a pyrometer; receiving ICME (Integrated Computational Materials Engineering) model output data for building the component wherein the ICME model output data includes predicted melt pool dimensions time-series data, predicted melt temperature time-series data, and predicted defects forming as a result of melt pool evolution and movement; and estimating using the received sensor data and the received ICME model output data one or more material properties associated with the metallic component using a material property prediction module configured to predict one or more of the material properties.