The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jul. 18, 2019
Coretronic Corporation, Hsin-Chu, TW;
Tsung-Ching Lin, Hsin-Chu, TW;
Wei-Chi Liu, Hsin-Chu, TW;
Coretronic Corporation, Hsin-Chu, TW;
Abstract
A liquid cooled heat dissipation module includes a housing and at least one flow channel. The housing includes a chamber, and the at least one flow channel is located in the chamber. The housing includes an upper plate, a lower plate, and a plurality of annular wall portions. Two ends of each of the annular wall portions are respectively connected to the upper plate and the lower plate. The annular wall portions respectively form a plurality of through-holes between the upper plate and the lower plate, and the through-holes penetrate through the upper plate and the lower plate. The at least one flow channel is located between two adjacent annular wall portions. In addition, a projection device is also provided.