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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11009408 B1

PDFFull Text
Date of Patent:
May. 18, 2021

Filed:

Jul. 26, 2016

Temperature measurement calibration in an additive manufacturing system

Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Esteve Comas, Sant Cugat del Valles, ES;

Sergio De Santiago Dominguez, Sant Cugat del Valles, ES;

Marina Ferran Farres, Sant Cugat del Valles, ES;

Assignee:

Hewlett-Packard Development Company, L.P., Spring, TX (US);

Attorney:

HP Inc. Patent Department

Primary Examiner:

Mirellys Jagan

Int. Cl.
CPC ...
G01K 15/00 (2006.01); G01J 5/00 (2006.01); G01K 1/00 (2006.01); G01K 7/00 (2006.01); B33Y 30/00 (2015.01); B29C 64/393 (2017.01); B29C 64/264 (2017.01); B33Y 50/00 (2015.01); G01J 5/08 (2006.01); G01J 5/60 (2006.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
G01K 15/005 (2013.01); B29C 64/264 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); G01J 5/0037 (2013.01); G01J 5/0896 (2013.01); G01J 5/605 (2013.01); G01K 15/00 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); G01J 2005/0048 (2013.01); G01J 2005/0085 (2013.01);
Abstract

Examples of temperature measurement calibration in an additive manufacturing system are described. In one case, a method of calibrating a non-contact temperature measurement device involves applying energy from a radiation source of the additive manufacturing system to heat a reference element. The reference element is thermally coupled to a temperature sensor. A temperature reading from the temperature sensor is compared with data from the non-contact temperature measurement device to calibrate the device.

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