The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Dec. 26, 2018
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masashi Shimura, Chino, JP;

Atsushi Matsuo, Shiojiri, JP;

Shinya Aoki, Minowa-machi, JP;

Shiro Murakami, Shiojiri, JP;

Ryuta Nishizawa, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/56 (2012.01); G01C 19/5642 (2012.01); H01L 41/09 (2006.01); H03B 5/32 (2006.01); H01L 41/047 (2006.01); H03H 9/15 (2006.01); G01C 19/5607 (2012.01); H03H 9/05 (2006.01); H03H 3/04 (2006.01); H03H 9/09 (2006.01); H03H 9/10 (2006.01); H03H 9/19 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
G01C 19/5642 (2013.01); G01C 19/5607 (2013.01); H01L 41/047 (2013.01); H01L 41/09 (2013.01); H03B 5/32 (2013.01); H03H 3/04 (2013.01); H03H 9/02133 (2013.01); H03H 9/0519 (2013.01); H03H 9/0552 (2013.01); H03H 9/09 (2013.01); H03H 9/1021 (2013.01); H03H 9/15 (2013.01); H03H 9/19 (2013.01); H03H 2003/0428 (2013.01);
Abstract

A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.


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