The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jul. 20, 2016
Applicant:
Smith International, Inc., Houston, TX (US);
Inventors:
John Daniel Belnap, Provo, UT (US);
Yi Fang, Orem, UT (US);
Michael David France, Lehi, UT (US);
David P. DenBoer, Pleasant Grove, UT (US);
Haibo Zhang, Lindon, UT (US);
Assignee:
SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/573 (2006.01); E21B 10/567 (2006.01); C22C 26/00 (2006.01); C22C 29/08 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); B22F 5/00 (2006.01); C04B 35/528 (2006.01); C04B 35/63 (2006.01); E21B 10/50 (2006.01); E21B 10/55 (2006.01);
U.S. Cl.
CPC ...
E21B 10/5735 (2013.01); B22F 7/062 (2013.01); B22F 7/08 (2013.01); C04B 35/528 (2013.01); C04B 35/6303 (2013.01); C04B 35/645 (2013.01); C04B 37/023 (2013.01); C04B 37/025 (2013.01); C04B 37/026 (2013.01); C22C 26/00 (2013.01); C22C 29/08 (2013.01); E21B 10/5673 (2013.01); E21B 10/573 (2013.01); B22F 2005/001 (2013.01); B22F 2302/10 (2013.01); B22F 2302/406 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/442 (2013.01); C04B 2235/96 (2013.01); C04B 2237/086 (2013.01); C04B 2237/12 (2013.01); C04B 2237/363 (2013.01); C04B 2237/401 (2013.01); C04B 2237/704 (2013.01); C04B 2237/72 (2013.01); E21B 10/50 (2013.01); E21B 10/55 (2013.01);
Abstract
Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.