The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jun. 23, 2017
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Kentaro Sano, Ehime, JP;
Taiki Kuroda, Ehime, JP;
Reo Takaiwa, Ehime, JP;
Noriyuki Hirano, Ehime, JP;
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/38 (2006.01); C08J 5/24 (2006.01); C08K 5/09 (2006.01); C08K 5/3445 (2006.01); C08K 5/55 (2006.01); C08G 59/40 (2006.01); C08L 63/06 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08J 5/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/38 (2013.01); C08G 59/40 (2013.01); C08G 59/4021 (2013.01); C08G 59/5073 (2013.01); C08J 5/24 (2013.01); C08K 5/09 (2013.01); C08K 5/3445 (2013.01); C08K 5/55 (2013.01); C08L 63/00 (2013.01); C08L 63/06 (2013.01); C08J 5/042 (2013.01);
Abstract
The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).