The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jul. 22, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Sadiq Bengali, Corvallis, OR (US);

Manish Giri, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B01L 3/00 (2006.01); B81B 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00071 (2013.01); B01L 3/502707 (2013.01); B81B 1/002 (2013.01); B81C 1/00119 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0887 (2013.01); B81B 2201/05 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0338 (2013.01); B81B 2203/04 (2013.01); B81C 2201/014 (2013.01); B81C 2201/016 (2013.01);
Abstract

Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.


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