The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Sep. 24, 2018
Applicant:

Slm Solutions Group Ag, Luebeck, DE;

Inventors:

Dieter Schwarze, Luebeck, DE;

Jiachun Chen, Luebeck, DE;

Assignee:

SLM Solutions Group AG, Luebeck, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); C30B 13/00 (2006.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B22F 10/30 (2021.01); C30B 29/52 (2006.01); B23P 6/00 (2006.01); F01D 5/00 (2006.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B22F 5/04 (2006.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B23P 6/007 (2013.01); B33Y 50/02 (2014.12); C30B 13/00 (2013.01); C30B 29/52 (2013.01); F01D 5/005 (2013.01); B22F 5/04 (2013.01); B22F 10/30 (2021.01); B22F 2202/05 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); F05D 2230/31 (2013.01);
Abstract

A method for producing or repairing a three-dimensional workpiece, the method including: depositing a sequence of layers of a raw material powder onto a substrate; after depositing a raw material powder layer, irradiating selected areas of the deposited raw material powder layer with an electromagnetic or particle radiation beam in a site selective manner in accordance with an irradiation pattern which corresponds to a geometry of at least part of a layer of the three-dimensional workpiece to be produced, the irradiation pattern including a scan pattern, wherein the substrate has a substantially single-crystalline microstructure; the irradiation is controlled so as to maintain the single-crystalline microstructure and to produce a metallurgical bond between sites of the raw material powder layer that are irradiated and the substrate and/or a previously deposited raw material powder layer, defining the scan pattern, so as to be one of a unidirectional or two directional scan pattern, rotating the scan pattern between two subsequently deposited raw material powder layers by a predetermined angle.


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