The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Sep. 07, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hideaki Watanabe, Fukuoka, JP;

Dai Yokoyama, Yamanashi, JP;

Shigeki Imafuku, Yamanashi, JP;

Yosuke Nagasawa, Yamanashi, JP;

Satoshi Matsuoka, Yamanashi, JP;

Kazuo Nagae, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01); H05K 13/046 (2013.01); H05K 13/0408 (2013.01); H05K 13/0421 (2013.01); H05K 13/0426 (2013.01); H05K 3/306 (2013.01); H05K 13/0812 (2018.08); H05K 13/0813 (2018.08); Y10T 29/49139 (2015.01);
Abstract

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.


Find Patent Forward Citations

Watanabe, Hideaki. (2021). Method of manufacturing component-mounted substrate (U.S. Patent No. 11006560). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11006560

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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