The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

May. 16, 2018
Applicant:

Amogreentech Co., Ltd., Gimpo-si, KR;

Inventor:

Sung-Baek Dan, Hwaseong-si, KR;

Assignee:

AMOGREENTECH CO., LTD., Gimpo-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/28 (2006.01); H05K 3/38 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/467 (2013.01); H05K 1/024 (2013.01); H05K 3/0047 (2013.01); H05K 3/28 (2013.01); H05K 3/386 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01);
Abstract

A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.


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