The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Jun. 28, 2016
Fuji Corporation, Chiryu, JP;
Kenji Tsukada, Toyota, JP;
Masatoshi Fujita, Anjyo, JP;
Yoshitaka Hashimoto, Kariya, JP;
Tasuku Takeuchi, Kariya, JP;
Akihiro Kawajiri, Chiryu, JP;
Masato Suzuki, Miyoshi, JP;
Katsuaki Makihara, Gamagori, JP;
FUJI CORPORATION, Chiryu, JP;
Abstract
A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.