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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11006521 B1

PDFFull Text
Date of Patent:
May. 11, 2021

Filed:

Jan. 24, 2018

Wiring base plate, electronic device package, and electronic device

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Isamu Kirikihira, Kirishima, JP;

Makoto Yamamoto, Kirishima, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/38 (2006.01); B01D 39/20 (2006.01); B01D 71/00 (2006.01); B01D 71/02 (2006.01); H01L 23/12 (2006.01); H01L 23/13 (2006.01); H01B 3/12 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H01B 3/12 (2013.01); H05K 1/09 (2013.01); H05K 5/0069 (2013.01);
Abstract

Provided are a wiring base plate and the like including an insulating substrate including a first surface portion including an aluminum oxide-based sintered body and a mullite-based sintered body; and a metallization layer including a second surface portion, the second surface portion containing at least one of a manganese compound and a molybdenum compound and being in contact with the first surface portion of the insulating substrate; wherein the second surface portion of the metallization layer and the first surface portion of the insulating substrate contain at least one of a manganese silicate phase and a magnesium silicate phase.

Find Patent Forward Citations

Kirikihira, Isamu. (2021). Wiring base plate, electronic device package, and electronic device (U.S. Patent No. 11006521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11006521

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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