The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Dec. 12, 2019
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Ryuta Yamada, Nagaokakyo, JP;
Yasuyuki Toyota, Nagaokakyo, JP;
Masaharu Fujiya, Nagaokakyo, JP;
Toru Takeshita, Nagaokakyo, JP;
Masaaki Shimada, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.