The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Sep. 21, 2016
Applicant:
Hella Gmbh & Co. Kgaa, Lippstadt, DE;
Inventors:
Wolfgang Nicke, Lörrach, DE;
Thomas Rost, Freiburg, DE;
Roland Schwarz, Todtnau, DE;
David Allouis, Bad Iburg, DE;
Assignee:
HELLA GMBH & CO. KGAA, Lippstadt, DE;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/32 (2006.01); H01Q 1/42 (2006.01); B29C 45/14 (2006.01); H05K 1/02 (2006.01); G01S 13/931 (2020.01); H05B 3/36 (2006.01); H05B 3/84 (2006.01); B29L 31/34 (2006.01); B29L 31/36 (2006.01); G01S 7/40 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/425 (2013.01); B29C 45/14377 (2013.01); B29C 45/14639 (2013.01); B29C 45/14836 (2013.01); G01S 13/931 (2013.01); H01Q 1/02 (2013.01); H01Q 1/3233 (2013.01); H01Q 1/42 (2013.01); H05B 3/36 (2013.01); H05B 3/84 (2013.01); H05K 1/028 (2013.01); H05K 1/0212 (2013.01); B29L 2031/3456 (2013.01); B29L 2031/36 (2013.01); G01S 2007/4047 (2013.01); G01S 2013/9327 (2020.01); H05B 2203/016 (2013.01); H05K 2201/09754 (2013.01); H05K 2201/10189 (2013.01); H05K 2203/1327 (2013.01);
Abstract
The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.