The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Mar. 01, 2019
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Wasif Tanveer Khan, Stuttgart, DE;
Mudassar Nauman, Stuttgart, DE;
Arndt Thomas Ott, Stuttgart, DE;
Ramona Hotopan, Stuttgart, DE;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01Q 1/48 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01Q 1/48 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/19032 (2013.01); H05K 1/0243 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.