The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Dec. 29, 2019
Applicant:

Suzhou Qingyue Optoelectronics Technology Co., Ltd., Kunshan, CN;

Inventors:

Xiaosong Du, Kunshan, CN;

Xiaolong Yang, Kunshan, CN;

Wenbin Zhou, Kunshan, CN;

Jian Sun, Kunshan, CN;

Yudi Gao, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 27/32 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); H01L 27/322 (2013.01); H01L 27/3246 (2013.01); H01L 27/3248 (2013.01); H01L 51/001 (2013.01); H01L 51/0021 (2013.01); H01L 51/524 (2013.01); H01L 51/5253 (2013.01); H01L 51/5271 (2013.01); H01L 51/5281 (2013.01); H01L 51/5012 (2013.01); H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); H01L 2227/323 (2013.01); H01L 2251/301 (2013.01); H01L 2251/303 (2013.01); H01L 2251/5369 (2013.01);
Abstract

The present invention provides a high-resolution Micro-OLED display module and a manufacturing method thereof. The method for manufacturing the high-resolution Micro-OLED comprises: S, providing a substrate, and manufacturing light-emitting pixel units on the substrate; S, encapsulating the light-emitting pixel units by a film encapsulation technique, and forming a film encapsulation layer; S, manufacturing sub-pixel units on the surface of the film encapsulation layer, and depositing a metal reflective layer between two sub-pixel units which are adjacent to each other; S, manufacturing a metal oxide layer on the surfaces of the metal reflective layer and the sub-pixel units by a deposition technique, to obtain a high-resolution Micro-OLED matrix; and S, using a cover plate to encapsulate the high-resolution Micro-OLED matrix produced in step S, to finish the manufacturing of a high-resolution Micro-OLED.


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