The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Nov. 20, 2018
Applicant:
Chen-fu Chu, Hsinchu, TW;
Inventor:
Chen-Fu Chu, Hsinchu, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/36 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 33/00 (2010.01); H01S 5/02232 (2021.01); H01S 5/022 (2021.01); B05C 5/02 (2006.01); B05C 9/12 (2006.01); B05C 9/14 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); H01L 31/16 (2006.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/153 (2013.01); H01L 27/156 (2013.01); H01L 33/36 (2013.01); H01L 33/505 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); B05C 5/0204 (2013.01); B05C 9/12 (2013.01); B05C 9/14 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 16/45525 (2013.01); C23C 16/50 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 21/7806 (2013.01); H01L 21/7813 (2013.01); H01L 31/16 (2013.01); H01L 33/0093 (2020.05); H01L 33/0095 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01); H01S 5/0224 (2013.01); H01S 5/02228 (2013.01); H01S 5/02232 (2013.01); H01S 5/02236 (2013.01);
Abstract
A semiconductor continuous array layer comprising: an array of multiple semiconductor units; a sidewall of each semiconductor unit is surrounded by a semi-cured material or a cured material connecting the semiconductor units together to form a semiconductor continuous array; wherein multiple voids or air gaps are enclosed by the semi-cured material or the cured material within the semiconductor continuous array or around the edge of the semiconductor continuous array.