The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Jun. 26, 2019
Applicant:

Xiamen San'an Optoelectronics Co., Ltd., Fujian, CN;

Inventors:

Senpeng Huang, Fujian, CN;

Zhen-duan Lin, Fujian, CN;

Weng-Tack Wong, Fujian, CN;

Junpeng Shi, Fujian, CN;

Shunyi Chen, Fujian, CN;

Chih-Wei Chao, Fujian, CN;

Chen-ke Hsu, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 33/0095 (2013.01); H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)∝B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.


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