The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Mar. 29, 2018
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Hartmut Rudmann, Jona, CH;

Markus Rossi, Jona, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/16 (2006.01); H01L 27/146 (2006.01); G02B 13/00 (2006.01); H01L 25/16 (2006.01); H01L 31/0232 (2014.01); H01L 31/167 (2006.01); G02B 3/00 (2006.01); G01J 1/02 (2006.01); G01J 5/04 (2006.01); G01J 1/04 (2006.01); G01J 1/06 (2006.01); G01J 1/42 (2006.01); G01J 5/00 (2006.01); G01J 5/02 (2006.01); G01J 5/20 (2006.01); G01J 5/08 (2006.01); B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/16 (2013.01); G01J 1/0209 (2013.01); G01J 1/0233 (2013.01); G01J 1/0271 (2013.01); G01J 1/0411 (2013.01); G01J 1/06 (2013.01); G01J 1/42 (2013.01); G01J 5/00 (2013.01); G01J 5/022 (2013.01); G01J 5/024 (2013.01); G01J 5/0235 (2013.01); G01J 5/0265 (2013.01); G01J 5/045 (2013.01); G01J 5/0806 (2013.01); G01J 5/20 (2013.01); G02B 3/0056 (2013.01); G02B 13/0085 (2013.01); H01L 25/167 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14687 (2013.01); H01L 31/02325 (2013.01); H01L 31/167 (2013.01); B29D 11/00298 (2013.01); B29D 11/00307 (2013.01); G01J 2001/061 (2013.01); G02B 3/0031 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49002 (2015.01);
Abstract

Manufacturing opto-electronic modules () includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack () in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules () can be obtained by separating the wafer stack () into separate modules.


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