The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Mar. 13, 2020
Applicants:

Sunpower Corporation, San Jose, CA (US);

Total Marketing Services and Total Energies Nouvelles Activites Usa, Puteaux, FR;

Inventors:

Richard Hamilton Sewell, Los Altos, CA (US);

David Aaron Randolph Barkhouse, Menlo Park, CA (US);

Nils-Peter Harder, San Jose, CA (US);

Douglas Rose, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 31/05 (2014.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02008 (2013.01); H01L 24/78 (2013.01); H01L 31/0504 (2013.01); H01L 31/0516 (2013.01); H01L 31/18 (2013.01); H01L 31/188 (2013.01); Y02E 10/50 (2013.01);
Abstract

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.


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