The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Aug. 14, 2017
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Sung Chul Joo, Raleigh, NC (US);

Peter Scott Andrews, Durham, NC (US);

Erin R. F. Welch, Ann Arbor, MI (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 27/15 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 24/97 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 33/507 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.


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