The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Feb. 17, 2020
Xilinx, Inc., San Jose, CA (US);
Anil Kumar Kandala, Hyderabad, IN;
Vijay Kumar Koganti, Hyderabad, IN;
Santosh Yachareni, Hyderabad, IN;
Sundeep Ram Gopal Agarwal, Hyderabad, IN;
XILINX, INC., San Jose, CA (US);
Abstract
Examples described herein generally relate to multi-chip devices having stacked chips. In an example, a multi-chip device includes a chip stack that includes chips. Neighboring chips are connected to each other. Plural chips of the chips collectively include columns of broken via pillars and bridges. Each of the plural chips has a broken via pillar in each column. The broken via pillar has first and second continuous via pillar portions aligned in a direction normal to a side of a semiconductor substrate of the respective chip. The first continuous via pillar portion is not connected within the broken via pillar to the second continuous via pillar portion. Each of the plural chips has one or more of the bridges. Each bridge connects, within the respective chip, the first continuous via pillar portion in a column and the second continuous via pillar portion in another column.